Technicure® Nano Dicy is a pulverized grade of dicyandiamide. It contains fumed silica to prevent clumping and enhance flow. Its extremely fine particle size enables a more complete reaction, facilitating faster curing without compromising formulation shelf stability.
Chemical Family: Guanidines, Silica
Labeling Claims: Not Listed In California Proposition 65
Compatible Polymers & Resins: Epoxies (EP)
Features: Excellent Adhesion, Fast Cure, Fast Curing, Good Adhesion, High Glass Transition Temperature, Improves Flow, Long Shelf Life, Low Temperature Performance, Multi-Substrate Adhesion, Prevents Clumping
End Uses: 1K (1 Component) Adhesive, Powder Coating, Pre-pregs