Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Industrial Additives Functions
- Technologies
- Product Families
Applications & Uses
- Markets
- Applications
- Applicable Processes
- Compatible Substrates & Surfaces
- Industrial Additives End Use
- Product Applications
NexSil™ 20NH4 colloidal silica was developed to be utilized in a range of applications. These materials may be used in applications related to:
- Production of vacuum-formed fibrous refractory products.
- Binder formulations for the production of materials such as granulated powders.
- Surface modification for anti-slip paper and cardboard coatings.
- Anti-blocking effects for films and coatings, including steel coatings.
- Catalyst production.
- Precision polishing of silicon wafers.
- Precision polishing of semiconductor substrates.
- Binder formulations for precision investment casting.
Properties
- Physical Form
- Appearance
- Clear to Translucent Solution
- Typical Properties
Value Units Test Method / Conditions Typical Particle Size 8 nm - Typical Surface Area 330 m²/g Silicon Dioxide Content 30 wt% - pH Value (at 25°C) 9.8 - - Specific Gravity 1.2 - - Sodium Oxide Content 0.45 % - Particle Charge Negative - -
Packaging & Availability
- Packaging Type
- Supplied by